✨ AI Summary
Nokia is seeking a Senior Packaging Development Engineer to lead the development of next-generation optical package designs for high-performance electro-optic modules. This role involves optimizing electrical assembly and RF signal efficiency, and ensuring a seamless transition to mass production. The engineer will own the design and development of advanced packaging activities including flip chip, fanout, thermo-compression bonding, reflow, and wirebonding processes. Responsibilities include collaborating with cross-functional teams, surveying advanced packaging solutions and materials, maintaining process and manufacturing documentation, driving package debug, and supporting development activities at contract manufacturers.
The ideal candidate will have 5-8 years of experience in high-speed electronics and Silicon Photonics package design, with hands-on experience in various packaging processes. Strong knowledge of microelectronics, optoelectronics packaging, and materials properties is required, along with experience in high-volume packaging of optical transceivers and modules. Excellent interpersonal, communication, and problem-solving skills are essential for effective collaboration. Experience with metrology techniques is also a requirement.
Requirements
Requires 5-8 years of experience in high-speed electronics and Silicon Photonics package design, including expertise in flip chip, fanout, bonding, soldering, and die attach processes. Must have experience in microelectronics and optoelectronics packaging design and assembly, along with knowledge of packaging technologies, materials, and high-volume packaging for optical transceivers and modules. Proficiency in documentation of fabrication, inspection, and assembly processes, as well as package and process design from concept to production, is essential. Experience with metrology techniques like SEM, XSEM, confocal microscopy, or acoustic imaging is required.
Description
Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!