IC Package Design & Automation Engineer

🏢 Nokia
📍 United StatesFull-timeOn-site
📅 Posted: 5mo ago🔄 Updated: 4mo ago
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✨ AI Summary
Nokia Bell Labs is seeking an IC Package Design & Automation Engineer to join their Integrated Circuits & Microsystems Research Lab. This role involves designing and validating high-speed packages using EM simulation, signal/power integrity analysis, and correlation with lab measurements. The engineer will also develop and maintain Assembly Design Kits (ADKs) across multiple EDA platforms, including rule decks, parameterized cells, and automated verification flows. The focus is on RF and optical packaging technologies, particularly with glass-core substrates.
Requirements
Requires a Ph.D. in Electrical Engineering or Physics with a minimum of 4 years of industry experience, or an MSEE with 8 years. Expertise in 2.5D/3D EM component design, package design software, PDKs/ADKs development, and SI/PI simulation is essential. Knowledge of IC packaging materials, microelectronics assembly, and RF/optoelectronics test equipment is also required.
Description

The successful candidate will design and validate high‑speed packages through EM simulation, signal/power integrity analysis, and correlation with lab test & measurement verification. In addition, you will develop and maintain ADKs across multiple EDA platforms, including rule decks, parameterized cells, technology files, and automated verification flows.

 

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🎯 Overalli74%
⚡ Skillsi85%
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Ontology Match: 85.0
Matched:✓ Requirements Matching✓ Ontology Skills Mapping
📜 Eligibilityi49%
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Local: 19600%
🏗️ Career Fiti91%
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Seniority: 91.0
📋 Requirementsi67%
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Domain: 67.0
🔥 Motivationi78%
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Title Fit: 78.00