✨ AI Summary
Nokia is seeking a Senior Mechanical Packaging Engineer to join their Advanced Packaging R&D team. The role involves the mechanical development of next-generation, high-performance electro-optic modules, integrating Silicon Photonics based Coherent optical transceivers into Nokia’s Photonic Service Engines from inception to New Product Introduction. The ideal candidate will have an advanced degree in Mechanical Engineering, 5-8 years of experience in high-volume packaging, and expertise in advanced photonics packaging technologies, 3D CAD design, simulations, material properties, and failure analysis. Responsibilities include leading package design, driving technology development, performing FEA and thermal analysis, and developing packaging processes.
Requirements
Requires an advanced degree in Mechanical Engineering or similar, with 5-8 years of experience in high-volume packaging of 2.5/3D packages and expertise in advanced photonics packaging technologies. Must have proficiency in 3D CAD, tolerance analysis, GD&T, thermal/thermo-mechanical simulations, material properties, and yield/failure analysis, along with experience in documentation and metrology techniques.
Description
As part of Nokia’s Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules. You will be responsible for the integration of Silicon Photonics based Coherent optical transceivers within Nokia’s Photonic Service Engines, from inception stage to New Product Introduction.